Business
We are committed to becoming the world's best company in the field of automation equipment.
Inspection System
Through self-developed S/W for product groups applied
Solar
It is also capable of meeting inspection specifications required by customers, such as vision optics and precision alignment technology using self-developed software; cell abnormality detection; and color inspection based on practical experience - and many achievements in the global solar manufacturing industry.
01
Semiconductor
For semiconductor manufacturing, FPA has exclusive technologies in detecting abnormalities and defects of wafers used in manufacturing bumpballs and dicing and experience in overseas setup for global semiconductor manufacturers.
02
Micro-Element / Film
It is also capable of size measurement and conformity assessment for microdevices including MLCC or ultra-thin film parts, and of responding in various ways to customer requirements through the selection of optical systems and internalization of algorithm development. With extensive experience in setup and maintenance, we are receiving an increased number of technical inquiries from major MLCC manufacturers in Korea.
03
Bump Ball Inspection
Equipment to identify defects of bump balls on semiconductor wafer substrates with a self-developed vision system
- Applicable to 4″ to 6″ wafers
- Automatic transportation and discharge
- 1.x um Resolution High speed TDI Linescan Camera Inspection
- Multi-axis control (X, Y, Z, Theta)
- Results analysis and statistics system
- Precise control through motion and vision calibration
- Convenient teaching by applying wafer map
- Applicable to MES (SECS & GEM, RMS)
- Detection of defects
- Automatic conversion of inspection results to Microsoft Excel Spreadsheet
Dicing Inspection
Equipment to detect chipping of the wafer surface with a self-developed vision system after the semiconductor wafer sawing
- Applicable to 4″ to 6″ wafers
- Automatic transportation and discharge
- 1.x um Resolution High speed TDI Linescan Camera Inspection
- Multi-axis control (X, Y, Z, Theta, StageZ)
- Results analysis and statistics system
- Precise control through motion and vision calibration
- Convenient teaching by applying wafer map
- Applicable to MES (SECS & GEM, RMS)
- Detection of defects
- Automatic conversion of inspection results to Microsoft Excel Spreadsheet
Micro LED Inspection
Equipment to inspect the products equipped with Micro LED with a self-developed vision system
- Applicable to all Micro / Mini LED sizes
- 1.x um Resolution Align Camera
- 1 um Resolution Highspeed TDI Linescan Camera Inspection(2D)
- 2.5 um Resolution Line Profile Laser Inspection(3D)
- Multi-axis control (X, Y, Z, Theta)
- Precise control through motion and vision calibration
- Results analysis and statistics system
- Detection of size, shift, rotation, inner/outer dust, scratch, and dehiscence
MLCC sizer
Equipment to automatically measure the external size of all chips with a single click of a button after inputting more than one MLCC into the jig
- Measuring in various ways according to (multiple or single) measurements, type, and input method
- Significantly reduced work time through batch measurement of chips within the area
- One-click measurement with a self-developed inspection algorithm
- Simple and convenient tools for recipe creation and teaching
- Automatic result collection and automatic conversion to Microsoft Excel Spreadsheet
- Automatic data analysis using statistics and graphs
Detection of untransferred EEST chips
Equipment to automatically detect/remove defective chips that have not been properly transferred from a large number of MLCCs in the dedicated jig
- Application of two types of jigs: tape line and palomar type
- Automatic detection algorithm through location analysis and color vision
- User-friendly Windows-based GUI
Single film inspector
Equipment included in the roll-to-roll process as an inspection module to detect curing, wrinkles, and foreign substances in the film
- Detection of the amount of film movement using a line scan camera
Crack Inspection / Color Vision
Solar cell manufacturing equipment and system to identify defects in wafers
- Applicable to all equipment types
- Applicable to defects such as cracks and abrading
- Results analysis and statistics system
- Application of color vision
